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Offices

Madrid, Spain

info@farphotonics.com
+34 605 604 822

Shedding light in all the stages of product development

Technical

7
Integrated Optics

Integrated Optics

Photonic integrated circuits (PICs) are tiny yet powerful chips capable of doing awesome things! PICs can implement complex optical systems with an unparalleled level of miniaturization, performance, and cost efficiency compared to conventional optics.

However, no single chip can do it all! There are multiple technology platforms with varying levels of maturity competing in the market, each uniquely suited for developing specific functionalities. There is no one-size-fits-all when it comes to PICs. That’s where FAR PHOTONICS comes in to guide you through the turbulent waters of the PIC landscape and help you navigate the choices:

Material Platform
Select the best-suited material/s platform/s for your application, unlocking the full potential of your PIC design.
System-Level Design
Assess your system-level design, providing critical insights and recommendations to optimize your solution.
Component-Level Design
Perform component-level design, ensuring every piece of your PIC puzzle fits perfectly.
Layout Generation

Generate layouts that meet or exceed the strict requirements of your application and foundry.

Foundry Liaison

And finally, liaise with the foundry to bring your PIC design to life!

Experimental Setups
Designing characterization setups, to test the electro-optical performance of your PICs under thermal and mechanical stabilization.
Integrated Optics

Packaging & Assembly

The fabrication of PICs is merely the first step in realizing photonics-based solutions. Effective system integration demands that PICs possess external connectivity and thermal and mechanical stability to ensure optimal performance in varying conditions.

FAR PHOTONICS has extensive experience in navigating the challenging waters of PIC packaging and assembly, and can guide you through the following crucial steps of your journey:

Packaging and Assembly
Materials Selection
Materials selection, to identify the best-suited materials for your PIC packaging, taking into consideration your application’s specific requirements and environmental conditions.
Package Design
Mechanical design of custom packages and other high-precision auxiliary assembly parts.
Thermal Design
Sizing either passive and active thermal heat sinks enabling proper heat dissipation.
Parts Inspection
Defining the best protocols for parts inspection, to ensure all components meet your specifications and quality standards.
Cleaning Procedures
Selecting the proper cleaning procedures, to guarantee your PICs and other parts are free from any contaminants that could compromise their performance.
Die Bonding Procedures
Defining die bonding procedures, to optimize both thermal and mechanical performance by engineering the adhesive bond lines.
Wire Bonding Procedures
Defining wire bonding procedures, to provide electrical connectivity to your PICs with excellent performance and reliability.
Sub-Micron Alignment and Attachment
Designing sub-micron alignment and attachment procedures, to provide PICs with best-in-class optical connectivity with outer means.
Dispensing and Curing Protocols
Designing adhesive dispensing and curing protocols, including the selection of the best-suited adhesive and workflow.
Packaging and Assembly
Opto-Mechanics

Opto-Mechanics

Opto-mechanical solutions arise at the intersection of optical and mechanical engineering and are at the core of many products today, ranging from advanced manufacturing to consumer electronics and healthcare.

The design requirements of a beam steering scanner assembled in a satellite, the focusing optics mounted in a high-speed camera for quality inspection on a fabrication line, or light coupling of a highly astigmatic laser source to a PIC are very different and navigating these requirements may be challenging. FAR PHOTONICS can be your compass in this journey by providing you with:

Feasibility Analysis
Feasibility analysis, ensuring viability of the optical concept.
System-Level Design
System-level design with both commercially available and custom optical parts.
Tolerance Analysis
Tolerance analysis, evaluating the impact of component variations and environmental factors on the performance.
Suppliers Liaison
Liaison with optical and mechanical suppliers, ensuring timely delivering of parts that meet the requirements.
Prototyping
Prototyping of optical systems, enabling integration testing activities.
Opto-Mechanics
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